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Cho-Bond 584-208 Epoxy Adhesive
CHO-BOND 584-208 is a two-component, silver-filled conductive epoxy adhesive system designed for applications where a strong, highly conductive electrical bond must be achieved.
Data Sheets
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CHO-BOND 584-208 is recommended for applications which require a conductive epoxy with an extended working life such as high-volume part dispensing or complex part assembly operations. With no VOCs and minimal shrinkage, CHO-BOND 584-208 is a good choice for a range of applications.
Curing of CHO-BOND 584-208 can be achieved in as little as 45 minutes with heat to minimize equipment downtime and increase manufacturing throughput. With a 1:1 weight mix ratio, CHO-BOND 584-208 is easy to handle and use.
Typical applications include bonding and grounding of electrical components, cold soldering, and bonding and sealing machined enclosures.
Shipping information
Entrega internacional (entrega puerta a puerta) está disponible para países seleccionados en todo el mundo. Envío se calculan automáticamente basado en el peso, la ubicación y la naturaleza peligrosa de las mercancías. Los clientes también pueden elegir fábrica para arreglar su propia colección.