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HexBond™ 322 Modified Epoxy Film Adhesive 380gsm 40SqMt Roll (Freezer Storage -18°C)
HexBond 322 is a high performance modified epoxy film adhesive curing at 175°C. It is suitable for bonding metal to metal and for sandwich structures.
Technical Information
- Código del producto 39209928
- País de Origen United Kingdom

Data Sheets
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HexBond 322 is a high performance modified epoxy film adhesive curing at 175°C. It is suitable for bonding metal to metal and for sandwich structures, where operating temperatures are experienced up to 220°C for short periods, or 200°C for continuous operation. Redux 322 is a hot melt film which is free from solvents and consequently has a very low volatile content.
Features:
- Cure at 175°C Good co-cure potential with 175°C curing prepregs
- Good hot lap shear performance
- Good high temperature performance in metal sandwich structures
- Low volatile content and low out gassing properties
- Available with or without a woven nylon carrier Applications Metal to metal bonding
- Sandwich constructions
Shipping information
Entrega internacional (entrega puerta a puerta) está disponible para países seleccionados en todo el mundo. Envío se calculan automáticamente basado en el peso, la ubicación y la naturaleza peligrosa de las mercancías. Los clientes también pueden elegir fábrica para arreglar su propia colección.