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Multicore MP 100 SN62 Solder Paste 500gm Jar (Fridge Storage)
Multicore MP 100 Solder Paste has been formulated as a pale, softresidue product for printing and reflow in air, where process yield is critical. This material offers excellent open time, greatly extended abandon times and good soldering activity over a wide range of reflow profile types and surface finishes.
Technical Information
- Número ONU 3082 CL9
- Código del producto 83113000
- País de Origen Hungary
Data Sheets
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Features:
- Effective over a wide range of printer cycle times and squeegee speeds
- Extended “between-print” abandon time
- Version suitable for ultra-fine pitch and 0201 chips
- Long component tack time
- Resists solder balling
- Excellent spread on a wide range of solderable surfaces
- Effective over a wide range of reflow profiles in air or nitrogen
- Soft, non-sticky post reflow residues for reduced maintenance in-circuit electrical testing
- Low colour post-reflow residues for easy visual inspection
Shipping information
Entrega internacional (entrega puerta a puerta) está disponible para países seleccionados en todo el mundo. Envío se calculan automáticamente basado en el peso, la ubicación y la naturaleza peligrosa de las mercancías. Los clientes también pueden elegir fábrica para arreglar su propia colección.