Please note - Silmid will be closed on Friday, 18th April 2025 and Monday, 21st April 2025 for the Easter Bank Holiday. We will reopen as usual on Tuesday, 22nd April 2025. Thank you for your continued support.
Alpha OM338-T (SN96.5/AG3.0/CU0.5) Solder Paste 500gm Pot (Fridge Storage)
Alpha OM-338-T is a lead-free, no-clean solder paste designed for a broad range of applications.
Technical Information
- Código del producto 38101000
- País de Origen Hungary
Data Sheets
Descarga hoy mismo la hoja técnica (TDS) del producto OM338T Alpha Paste Flux y la hoja de datos de seguridad (SDS) del producto OM338T Alpha Paste Flux desde Silmid. Una vez que hayas iniciado sesión o te hayas registrado, la hoja de datos será visible para su descarga. Conéctese para acceder a las hojas de datosInformación del producto
Alpha OM-338-T's broad processing window is designed to minimize transition concerns from tin/lead to lead free solder paste. This material is engineered to deliver the comparable performance to a tin lead process. It yields excellent print capability performance across various board designs and, particularly, with ultra fine feature repeatability (11 mil Squares) and high throughput applications.
The outstanding reflow process window delivers good soldering on CuOSP with excellent coalescence on a broad range of deposit sizes, excellent random solder ball resistance and mid-chip solder ball performance. Additionally, Alpha OM-338-T is formulated to deliver exceptional visual joint cosmetics.
Shipping information
Entrega internacional (entrega puerta a puerta) está disponible para países seleccionados en todo el mundo. Envío se calculan automáticamente basado en el peso, la ubicación y la naturaleza peligrosa de las mercancías. Los clientes también pueden elegir fábrica para arreglar su propia colección.