Grosvenor Pureflow F (SN63/PB37) High Purity Solder Bar (25Kg Pack)

PureFlow-F solder evolved from a series of investigations aimed at discovering the basic facts governing the formation of dross on molten solder. PureFlow solder alloy is specially formulated to improve solder flow and reduce oxide formation on the solder surface during operation of a solder bath.

The demands of modern electronics design have led to more densely populated PCBs with a resultant rise in defect rates during soldering processes. Pureflow-F is designed to meet these stringent requirements by increasing flow rates and fluidity of the solder in the bath to improve both wetting and drainage during soldering, thereby reducing the incidence of defects.

Solder oxides will form more rapidly on a constantly moving surface such as that encountered in a solder wave. The use of turbulent waves to improve solder access to miniature chip components only serves to compound this problem. In all such applications the use of PureFlow-F solder is to the benefit of both the economics of the operation and to the quality of the soldered boards.

Apart from reducing waste, PureFlow-F is more efficient because the quantity of solder deposited on the boards is reduced, resulting in neater joints and decreasing the possibility of icicling and bridging. Inspection and rework time is therefore reduced to a minimum.

Features:

• High Purity alloy for high performance soldering
• Improved yields, especially on densely populated boards
• Special alloy composition improves flow and reduces oxide formation for more consistent results.
• Bright solder joints
• Low impurity levels increase life of alloy in the solder bath and reduce bath maintenance.