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Loctite Ablestik QMI519 Heat Cure Adhesive 5cc Syringe (Freezer Storage -40°C)
LOCTITE ABLESTIK QMI519 silver filled conductive adhesive is recommended for use in bonding integrated circuits and components to metal lead frames.
Technical Information
- Code des marchandises 35061000
- Pays d'origine South Korea
Data Sheets
Téléchargez dès aujourd'hui la fiche technique (TDS) du produit Loctite Ablestik QMI519 Heat Cure Adhesive 5cc Syringe (Freezer Storage -40°C) ainsi que la fiche de données de sécurité (SDS) du produit Loctite Ablestik QMI519 Heat Cure Adhesive 5cc Syringe (Freezer Storage -40°C) depuis Silmid. Une fois que vous vous êtes connecté(e) ou inscrit(e), la fiche technique sera visible et téléchargeable. Veuillez vous connecter afin d’avoir accès aux fiches techniquesInformations produits
It is is designed to achieve UPHs several orders of magnitude higher than conventional oven cured adhesives. Maximum productivity is realised through in-line cure, either on the diebonder using a post diebond heater or on the wirebonder preheater. Studies have also shown improved coplanarity in parts cured on the diebonder.
Features:
- Electrically conductive
- Thermally conductive
- One component
- Ease of use Void-free bondline
- Hydrophobic Stable at high temperatures
- High resistance to delamination
- Good resistance to
popcorning
after exposure to reflow temperatures
Shipping information
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