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CHO-BOND 1029 is a two-component, silver-plated copper-filled conductive silicone formulated for applications requiring a strong, flexible, and conductive electrical bond. It is supplied as one part liquid and one part wet powder solid. For optimal adhesion, CHO-BOND 1029 is recommended for use with CHO-SHIELD 1085 primer. CHO-BOND 1085 primer is an air-drying liquid coating used to improve the adhesion of conductive silicone compounds to metal and other non-silicone substrates.

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Cho-Bond 1029 & Catalyst 1085 Flexible Electrically Conductive Silicone Adhesive

Silmid P/N: VAR0000516
Cho-Bond 1029 & Catalyst 1085 Flexible Electrically Conductive Silicone Adhesive
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De €306.08 (hors TVA) €367.30 (TVA comprise)
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CHO-BOND 1029 is a two-component, silver-plated copper-filled conductive silicone formulated for applications requiring a strong, flexible, and conductive electrical bond. It is supplied as one part liquid and one part wet powder solid. For optimal adhesion, CHO-BOND 1029 is recommended for use with CHO-SHIELD 1085 primer. CHO-BOND 1085 primer is an air-drying liquid coating used to improve the adhesion of conductive silicone compounds to metal and other non-silicone substrates.

Data Sheets

Téléchargez dès aujourd'hui la fiche technique (TDS) du produit Cho-Bond 1029 & Catalyst 1085 Flexible Electrically Conductive Silicone Adhesive ainsi que la fiche de données de sécurité (SDS) du produit Cho-Bond 1029 & Catalyst 1085 Flexible Electrically Conductive Silicone Adhesive sur Silmid. Une fois que vous vous êtes connecté(e) ou inscrit(e), sélectionnez la taille du produit qui vous intéresse et la fiche technique sera disponible en téléchargement.

Informations produits

CHO-BOND 1029 is specifically formulated to simplify the bonding of conductive silicone EMI gaskets to metal substrates. Designed for small bond lines (less than 0.010 inches), it is not intended for use as an EMI caulk where bond lines exceed 0.10 inches. With low volatile organic compounds (VOCs) and minimal shrinkage during curing, CHO-BOND 1029 is well-suited for both commercial and military applications. When heat-cured, it can achieve full bonding in as little as 30 minutes, helping to reduce equipment downtime and improve manufacturing throughput. Typical applications include bonding, repairing, and attaching EMI gaskets, as well as sealing around EMI vents and windows.

For optimal adhesion, CHO-BOND 1029 is recommended for use with CHO-SHIELD 1085 primer (supplied in this kit). CHO-BOND 1085 is moisture reactive and clear in colour. This primer is formulated to achieve maximum adhesion on non-silicone substrates for CHO-BOND 1029 adhesive.

Shipping information

Livraison internationale (livraison de porte à porte) estdisponible pour certains pays dans le monde entier.Livraison sera automatiquement calculé sur le poids,l’emplacement et la nature dangereuse des marchandises.Les clients peuvent également choisir à l’usine d’organiserleur propre collection. 

Veuillez vous reporter à notre page de livraison pour plusd’informations.