Cho-Therm 1641 A/B Silicone Compound (Includes 1086 Primer)
CHO-THERM 1641 compound is a one-component, thermally conductive, electrically insulating (non-acetic acid generating), silicone-based RTV adhesive/sealant/potting compound. The material offers high thermal conductivity, flexibility, excellent high and low-temperature resistance, as well as electrical insulation.
Data Sheets
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Components of circuits encapsulated in cured CHO-THERM 1641 compound are accessible by cutting away the compound. After repair, the components can be re-encapsulated with no loss in performance. CHO-THERM 1641 compound will stick, but not permanently bond to most non-silicone surfaces. A permanent bond can be made, if desired, by using Chomerics' CHO-BOND 1086 primer. Components potted in CHO-THERM 1641 compound have excellent thermal and mechanical shock resistance, thermal diffusivity and moisture resistance.
CHO-THERM 1641 compound may also be used as a cure-in-place thermal grease. The excess material will cure and thereby be resistant to vapour degreasing, and it is possible to attain very low thermal impedance. The cured CHO-THERM 1641 compound will not separate or migrate on the heat sink or circuit board.
The CHOTHERM 1641 compound will stick to non-silicone materials. If easy removal is needed, the package and heat sink should be brush painted with a mould release before application. Adhesion to non-silicone surfaces may be improved by using Chomerics CHOBOND 1086 primer.
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