EPO-TEK® H20S A/B Electrical Adhesive
Silmid P/N: VAR0002082
From $441.95 $441.95
Epotek H20S Adhesive is a modified version of Epotek H20E designed primarily for die stamping and dispensing techniques for chip bonding.
Data Sheets
Download the EPO-TEK® H20S A/B Electrical Adhesive technical data sheet (TDS) and the EPO-TEK® H20S A/B Electrical Adhesive safety data sheet (SDS) from Silmid today. Once you have logged in or signed up, select the product size you are interested in and the datasheet will be visible for download if one is available. Please login and select to access DatasheetsProduct Information
Epotek H20S Adhesive is a modified version of Epotek H20E designed primarily for die stamping and dispensing techniques for chip bonding, a highly reliable two component silver filled epoxy with a smooth thixotropic consistency.
Features:
- High electrical conductivity
- Short curing cycles
- Especially recommended for use in high speed epoxy chip bonding systems where fast cures are highly desirable
- Suggested for JEDEC level lll and ll plasticIC packaging
- Low temperature cure makes it ideal for flex circuity and other low stress applications
- Used extensively for bonding quartz crystal oscillators and other stress sensitive chips
- Used for die and SMD bonding inside hybrid/hermetic packages such as DIP and To-Cans also EMI/Rf shielding of micro-electronics
Shipping information
International delivery (door to door delivery) is available for selected countries worldwide. Shipping will be automatically calculated based on the weight, location and hazardous nature of the goods. Customers can also choose ex works to arrange their own collection.
Please refer to our delivery page for more information.
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