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Cho-Bond 584-29 Epoxy Adhesive
CHO-BOND 584-29 is a two-component, silver-filled, conductive epoxy adhesive system designed for applications where a strong, highly conductive electrical bond must be achieved.
Data Sheets
Download the Cho-Bond 584-29 Epoxy Adhesive 10gm Bipack technical data sheet (TDS) and the Cho-Bond 584-29 Epoxy Adhesive 10gm Bipack safety data sheet (SDS) from Silmid today. Once you have logged in or signed up, the datasheet will be visible for download if one is available. Please login to access DatasheetsProduct Information
CHO-BOND 584-29 is recommended for relatively small bond lines (less than 0.010 inches (0.25mm)) but can be used for larger bond lines in applications where vibration or potential for cracking is not an issue. With low VOCs and minimal shrinkage, CHO-BOND 584-29 is a good choice for a range of applications.
The fine silver filler of CHO-BOND 584-29 makes it a good material choice for precise application in and around tight spaces and electrical components. CHO-BOND 584-29 comes in a variety of sizes and packaging so customers can choose a package and material size which is right for their application, minimizing material scrap and mixing issues.
Curing of CHO-BOND 584-29 can be achieved in as little as 15 minutes with heat to minimize equipment downtime and increase manufacturing throughput. Typical applications include bonding and grounding of electrical components, cold soldering, and bonding and sealing machined enclosures.
Shipping information
International delivery (door to door delivery) is available for selected countries worldwide. Shipping will be automatically calculated based on the weight, location and hazardous nature of the goods. Customers can also choose ex works to arrange their own collection.
Please refer to our delivery page for more information.