Lord CoolTherm EP-2000 A/B Epoxy Adhesive 1USG Kit
CoolTherm EP-2000 encapsulant is a two-component, low viscosity epoxy system designed for encapsulation of devices with small-diameter, tightly-packed windings. It provides high-temperature stability combined with excellent electrical insulation.
Technical Information
- Commodity Code 38249992
- Country of Origin United States
Data Sheets
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Features:
- Excellent Heat Dissipation – provides lower motor end winding temperatures during high-power operation
- Low Viscosity – provides fine-particle filler and low viscosity; self-levels to fill voids in motor stators/rotors, transformer coils and other electrical devices
- Durable – cured material resists cracking during multiple thermal cycles from sub-zero temperatures to 200°C
Shipping information
International delivery (door to door delivery) is available for selected countries worldwide. Shipping will be automatically calculated based on the weight, location and hazardous nature of the goods. Customers can also choose ex works to arrange their own collection.
Please refer to our delivery page for more information.