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HexBond™ 319 Modified Epoxy Film Adhesive
HexBond 319 is a high performance modified epoxy film adhesive curing at 175°C. It is available in both supported and unsupported versions at areal weights between 180 and 400 g/m2.
Data Sheets
Download the HexBond™ 319 Modified Epoxy Film Adhesive technical data sheet (TDS) and the HexBond™ 319 Modified Epoxy Film Adhesive safety data sheet (SDS) from Silmid today. Once you have logged in or signed up, select the product size you are interested in and the datasheet will be visible for download if one is available. Please login and select to access DatasheetsProduct Information
HexBond 319 is a high performance modified epoxy film adhesive curing at 175°C. It is available in both supported and unsupported versions at areal weights between 180 and 400 g/m2. The supported versions contain a woven nylon carrier for glueline thickness control and improved handleability. HexBond 319 is a hot melt film which is free from solvents and consequently it has a very low volatile content.
Features:
- Cures in 60 minutes at 175°C
- Good performance at temperatures ranging from -55°C to 150°C
- Good short-term exposure performance at 175°C
- Excellent peel properties
- Good drape at ambient temperatures
- Less than 1% volatile content
Applications:
- Aluminium to aluminium bonding
- Fibre-reinforced composite to composite bonding
- Aluminium honeycomb sandwich bonding
- Aramid honeycomb sandwich bonding
Shipping information
International delivery (door to door delivery) is available for selected countries worldwide. Shipping will be automatically calculated based on the weight, location and hazardous nature of the goods. Customers can also choose ex works to arrange their own collection.
Please refer to our delivery page for more information.