HumiSeal TS 300 Tempseal Mask 1/2USP Bottle

HumiSeal TS300 is a non-flammable, high temperature, temporary mask designed for use on printed circuit boards that require masking during the conformal coating process. HumiSeal TS 300 effectively covers and protects parts and connections where coating is not desired, and can then be peeled away easily.

HumiSeal TS 300 contains no ammonia and will not inhibit thermal cure of silicone conformal coatings. HumiSeal TS 300 can withstand limited exposure to temperatures as high as 260°C.

Features:

• Applies easily from applicator bottle, dispensing machines or brushing.
• Keeps contact points and connections free of coating.
• Will cure at room temperature in one hour or in 20 to 30 minutes at elevated temperatures.
• Changes color from pink to translucent red when cured.
• Will not tarnish gold, copper and phosphor bronze.
• Easily removed by peeling - leaves no residue to interfere with subsequent operations.
• Material can withstand soldering temperatures up to 260°F.