HumiSeal TS 300 Tempseal Mask 1/2USP Bottle
HumiSeal TS 300 is a non-flammable, high temperature, temporary mask specially designed and formulated to be used on printed circuit boards that require masking during the conformal coating process.
Technical Information
- Commodity Code 40012900
- Country of Origin United Kingdom
Data Sheets
Download the HumiSeal TS 300 Tempseal Mask 1/2USP Bottle technical data sheet (TDS) and the HumiSeal TS 300 Tempseal Mask 1/2USP Bottle safety data sheet (SDS) from Silmid today. Once you have logged in or signed up, the datasheet will be visible for download if one is available. Please login to access DatasheetsProduct Information
HumiSeal TS300 is a non-flammable, high temperature, temporary mask designed for use on printed circuit boards that require masking during the conformal coating process. HumiSeal TS 300 effectively covers and protects parts and connections where coating is not desired, and can then be peeled away easily.
HumiSeal TS 300 contains no ammonia and will not inhibit thermal cure of silicone conformal coatings. HumiSeal TS 300 can withstand limited exposure to temperatures as high as 260°C.
Features:
- Applies easily from applicator bottle, dispensing machines or brushing.
- Keeps contact points and connections free of coating.
- Will cure at room temperature in one hour or in 20 to 30 minutes at elevated temperatures.
- Changes color from pink to translucent red when cured.
- Will not tarnish gold, copper and phosphor bronze.
- Easily removed by peeling - leaves no residue to interfere with subsequent operations.
- Material can withstand soldering temperatures up to 260°F.
Shipping information
International delivery (door to door delivery) is available for selected countries worldwide. Shipping will be automatically calculated based on the weight, location and hazardous nature of the goods. Customers can also choose ex works to arrange their own collection.
Please refer to our delivery page for more information.