DOWSIL™ 340 Heat Sink Compound
Dowsil 340 Heat Sink Compound is a non-curing and non-flowing thermally conductive compound.
Data Sheets
Download the Dowsil 340 technical data sheet (TDS) and the Dowsil 340 safety data sheet (SDS) from Silmid today. Once you have logged in or signed up, select the product size you are interested in and the datasheet will be visible for download if one is available. Please login and select to access DatasheetsProduct Properties
Product Information
The product is specifically designed to provide long-term bonding and to protect against moisture, environmental attack, mechanical and thermal shock as well as vibration especially where a high-strength product is required. Its typical applications include bonding of sensitive electronic components and sub-assemblies.
Features:
- one part
- Non-sag
- Room temperature cure
- Neutral alkoxy cure system
- Excellent adhesion to glass, ceramics, metals, silicone rubber and many plastics
- High tear strength flexible rubber - protects against mechanical shock and thermal cycling stress at components
- Stable and flexible from -50°C to +200°C
- Excellent dielectric properties
- Non-corrosive
- Aerospace standard
Shipping information
International delivery (door to door delivery) is available for selected countries worldwide. Shipping will be automatically calculated based on the weight, location and hazardous nature of the goods. Customers can also choose ex works to arrange their own collection.
Please refer to our delivery page for more information.