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SYLGARD™ 567 Primerless Silicone Encapsulant
Dow SYLGARD™ 567 Primerless Silicone Encapsulant Black is a two component material. This product can be used in various applications.
Data Sheets
Download the SYLGARD™ 567 Primerless Silicone Encapsulant technical data sheet (TDS) and the SYLGARD™ 567 Primerless Silicone Encapsulant safety data sheet (SDS) from Silmid today. Once you have logged in or signed up, select the product size you are interested in and the datasheet will be visible for download if one is available. Please login and select to access DatasheetsProduct Information
Dow SYLGARD 567 Primerless Silicone Encapsulant Black is a two component material that is used in potting applications for automotive assemblies, power supplies, high voltage resistor packs, LED lighting, industrial controls, and connectors. It offers unprimed adhesion, heat curing, flowability, minimal shrinkage, low viscosity, and good dielectric properties.
Features:
- 1 to 1 mix ratio
- Flowable
- Self-priming
- UL 94 V-0 Recognized
- No additional priming step required
- Rapid, versatile cure processing controlled by temperature
- Low viscosity enhances flow and fill in narrow spaces and around complex geometries
- Good dielectric properties
Shipping information
International delivery (door to door delivery) is available for selected countries worldwide. Shipping will be automatically calculated based on the weight, location and hazardous nature of the goods. Customers can also choose ex works to arrange their own collection.
Please refer to our delivery page for more information.