Multicore MP 100 SN62 Solder Paste 500gm Jar (Fridge Storage)
Multicore MP 100 Solder Paste has been formulated as a pale, softresidue product for printing and reflow in air, where process yield is critical. This material offers excellent open time, greatly extended abandon times and good soldering activity over a wide range of reflow profile types and surface finishes.
Technical Information
- UN Number 3082 CL9
- Commodity Code 83113000
- Country of Origin Hungary
Data Sheets
Download the Multicore MP 100 SN62 Solder Paste 500gm Jar (Fridge Storage) technical data sheet (TDS) and the Multicore MP 100 SN62 Solder Paste 500gm Jar (Fridge Storage) safety data sheet (SDS) from Silmid today. Once you have logged in or signed up, the datasheet will be visible for download if one is available. Please login to access DatasheetsProduct Information
Features:
- Effective over a wide range of printer cycle times and squeegee speeds
- Extended “between-print” abandon time
- Version suitable for ultra-fine pitch and 0201 chips
- Long component tack time
- Resists solder balling
- Excellent spread on a wide range of solderable surfaces
- Effective over a wide range of reflow profiles in air or nitrogen
- Soft, non-sticky post reflow residues for reduced maintenance in-circuit electrical testing
- Low colour post-reflow residues for easy visual inspection
Shipping information
International delivery (door to door delivery) is available for selected countries worldwide. Shipping will be automatically calculated based on the weight, location and hazardous nature of the goods. Customers can also choose ex works to arrange their own collection.
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